'422'

'22'

'微电子封装技术的优势与应用'

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'现阶段，电子封装技术在电子设备运用中发挥着非常重要的作用，特别是在电子器件功能集成以及布局优化等方面，发挥的作用日益重要，应用需求也大幅度加强。文章主要就微电子封装技术的优势与应用展开详细论述。'

'990'

'1'

'ruilang'

'9'

'/index.php?c=show&id=422'

'0'

'0'

''

'2022-04-22 09:48:18'

'2022-04-22 09:48:18'

'0'

NULL

'来自网络'

'<p arial="" style="margin: 0px; padding: 0px; outline: 0px; text-align: justify; color: rgb(34, 34, 34); text-transform: none; text-indent: 0px; letter-spacing: 0.54px; clear: both; font-family: -apple-system, BlinkMacSystemFont,;"><span style="margin: 0px; padding: 0px; outline: 0px; font-family: 宋体; visibility: visible; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word;">在电子产品高性能、高集成以及小型化发展背景下，微电子技术应用需求呈现出日益上升的趋势。微电子技术逐渐发展为信息社会的支柱性产业，发挥的作用越来越大。而微电子技术发展的重要标志在于半导体集成电路飞速发展。近年来，我国在微电子技术方面的重视度逐渐提升，而且积极布局投入，随着社会创新氛围的日益浓郁，微电子技术获得迅速发展和进步。就微电子发展水平进行分析，IC芯片技术以及微电子封装技术息息相关，联系密切，两者是相互促进的关系，所以说，微电子封装技术向着小型化转变，促使其更好地满足环保要求。</span></p>

<p arial="" style="margin: 0px; padding: 0px; outline: 0px; text-align: justify; color: rgb(34, 34, 34); text-transform: none; text-indent: 0px; letter-spacing: 0.54px; clear: both; font-family: -apple-system, BlinkMacSystemFont,;"><span style="margin: 0px; padding: 0px; outline: 0px; font-family: 宋体; visibility: visible; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word;">&nbsp;</span></p>

<p arial="" style="margin: 0px; padding: 0px; outline: 0px; text-align: justify; color: rgb(34, 34, 34); text-transform: none; text-indent: 0px; letter-spacing: 0.54px; clear: both; font-family: -apple-system, BlinkMacSystemFont,;"><span style="margin: 0px; padding: 0px; outline: 0px; font-family: 宋体; visibility: visible; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word;">1 微电子封装技术发展现状</span></p>

<p arial="" style="margin: 0px; padding: 0px; outline: 0px; text-align: justify; color: rgb(34, 34, 34); text-transform: none; text-indent: 0px; letter-spacing: 0.54px; clear: both; font-family: -apple-system, BlinkMacSystemFont,;"><span style="margin: 0px; padding: 0px; outline: 0px; font-family: 宋体; visibility: visible; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word;">&nbsp;</span></p>

<p arial="" style="margin: 0px; padding: 0px; outline: 0px; text-align: justify; color: rgb(34, 34, 34); text-transform: none; text-indent: 0px; letter-spacing: 0.54px; clear: both; font-family: -apple-system, BlinkMacSystemFont,;"><span style="margin: 0px; padding: 0px; outline: 0px; font-family: 宋体; visibility: visible; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word;">自20世纪以来，通信行业获得快速发展，进而促使微电子行业成为世界重要产业之一，并逐渐发展为我国重要支柱产业。目前，微电子被分离成三个独立产业，分别是设计产业、制造产业以及封装产业，这三个产业都是我国支柱性产业。在现代社会快速发展的背景下，微电子封装技术成为IT行业关键性技术，也是微电子产业关键性组成部分之一。从微电子封装技术定义上进行分析，主要是指将大量半导体电子元件进行组装，使其成为完整封装体，且电源需要由外界提供。从某种程度上讲，微电子封装可以促使IC得到正常运作，最大限度避免外界干扰，因此微电子封装必须要在电子器件方面满足用户个性化设计需求，保证质量等各方面指标是合格的、可靠的。</span></p>

<p arial="" style="margin: 0px; padding: 0px; outline: 0px; text-align: justify; color: rgb(34, 34, 34); text-transform: none; text-indent: 0px; letter-spacing: 0.54px; clear: both; font-family: -apple-system, BlinkMacSystemFont,;"><span style="margin: 0px; padding: 0px; outline: 0px; font-family: 宋体; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word;">&nbsp;</span></p>

<p arial="" style="margin: 0px; padding: 0px; outline: 0px; text-align: justify; color: rgb(34, 34, 34); text-transform: none; text-indent: 0px; letter-spacing: 0.54px; clear: both; font-family: -apple-system, BlinkMacSystemFont,;"><span style="margin: 0px; padding: 0px; outline: 0px; font-family: 宋体; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word;">目前，微电子封装技术具有非常多的种类，根据封装方式进行划分，可以分为通孔入式以及表面安装式。将微电子封装技术按照发展阶段进行划分，可以分成以下三个阶段：第一是20世纪70年代，微电子封装技术属于传统形式的插装型封装，发展到20世纪70年代后期时，逐渐以双列直插封装为主，且该类型封装技术获得广泛应用，例如模压陶瓷等。第二是20世纪80年代，常见的微电子封装技术为表面安装技术，该时期的封装技术发展得比较成熟了，然而因表面封装技术引线排列方面存在一定缺陷，若要使表面全部引线维持共面状态的难度非常大。为了缓解这一困难，就发展处一种新的技术，那就是引线扁平封装技术。该技术与插装型封装技术进行对比，鲜明的特点就在于封装大小与操作难度都大大减小。第三是20世纪90年代，在现代化社会发展的背景下，电子技术得到迅速发展，且集成电路技术发展水平也在日益提升，大量新技术频繁出现，从而使其对现存微电子封装技术提出了更加严格的要求，四边引线封装发展为平面型封装，并且成为现代社会应用最为广泛的封装技术。发展到20世纪90年代后期时，封装技术积极革新，使现在微电子封装技术向着小型化与低功耗的方向迈进。</span></p>

<p arial="" style="margin: 0px; padding: 0px; outline: 0px; text-align: justify; color: rgb(34, 34, 34); text-transform: none; text-indent: 0px; letter-spacing: 0.54px; clear: both; font-family: -apple-system, BlinkMacSystemFont,;"><span style="margin: 0px; padding: 0px; outline: 0px; font-family: 宋体; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word;">&nbsp;</span></p>

<p arial="" style="margin: 0px; padding: 0px; outline: 0px; text-align: justify; color: rgb(34, 34, 34); text-transform: none; text-indent: 0px; letter-spacing: 0.54px; clear: both; font-family: -apple-system, BlinkMacSystemFont,;"><span style="margin: 0px; padding: 0px; outline: 0px; font-family: 宋体; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word;">2 微电子封装技术优势分析</span></p>

<p arial="" style="margin: 0px; padding: 0px; outline: 0px; text-align: justify; color: rgb(34, 34, 34); text-transform: none; text-indent: 0px; letter-spacing: 0.54px; clear: both; font-family: -apple-system, BlinkMacSystemFont,;"><span style="margin: 0px; padding: 0px; outline: 0px; font-family: 宋体; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word;">&nbsp;</span></p>

<p arial="" style="margin: 0px; padding: 0px; outline: 0px; text-align: justify; color: rgb(34, 34, 34); text-transform: none; text-indent: 0px; letter-spacing: 0.54px; clear: both; font-family: -apple-system, BlinkMacSystemFont,;"><span style="margin: 0px; padding: 0px; outline: 0px; font-family: 宋体; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word;">当一块IC制造完成后，就包含着所有设计功能的有效发挥，而且具有非常强的可靠性。从某种程度上讲，芯片“封装”环节的存在本来是意义不大的，究其原因在于封装不会添加价值，反之，不适宜的电子封装还会导致功能下降。很早之前，系统开发者已经尝试摆脱封装，直接将IL设置安装于电路基板上。从实践上来看，IBM公司的凸点倒装芯片以及AT&T公司的梁式引线都进行了实践，之后Delco Electronics Lucent公司将芯片焊接到陶瓷基板上。然而，在实际操作过程中，不需要封装的IC会受到多种因素的影响，往往难以实现。其实，使用封装的IC也存在一些好处，比如，可以对脆弱敏感芯片进行保护，还方便传送、返修以及测试等，有助于实现引脚的标准化，让装配工作更加科学化，还能够改善IC热失配等。综上所述，各类微电子IC芯片还是需要封装的，促使微电子封装技术快速发展。</span></p>

<p arial="" style="margin: 0px; padding: 0px; outline: 0px; text-align: justify; color: rgb(34, 34, 34); text-transform: none; text-indent: 0px; letter-spacing: 0.54px; clear: both; font-family: -apple-system, BlinkMacSystemFont,;"><span style="margin: 0px; padding: 0px; outline: 0px; font-family: 宋体; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word;">&nbsp;</span></p>

<p arial="" style="margin: 0px; padding: 0px; outline: 0px; text-align: justify; color: rgb(34, 34, 34); text-transform: none; text-indent: 0px; letter-spacing: 0.54px; clear: both; font-family: -apple-system, BlinkMacSystemFont,;"><span style="margin: 0px; padding: 0px; outline: 0px; font-family: 宋体; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word;">在微电子技术持续发展的背景下，芯片特征以及尺寸日益缩小，一块芯片可以集成六七千万甚至是更多电路，增强了集成电路功能，与此同时，整机以及系统都呈现出小型化、高可靠性、高性能以及高密度的趋势，价格比竞争日益强烈，IC品种不断扩展，上述因素都促使微电子封装快速向前发展，不同类型的封装结构层出不穷。从某种程度上讲，微电子封装技术水平提升，又反作用于IC以及电子器件发展。电子系统小型化以及高性能化发展趋势，促使电子封装的价值提升，甚至可以与芯片价值相提并论了。比如，同样功能电子系统不仅能够采用单芯片封装方式进行组装，而且还能够采用MCM封装技术组装。两者进行对比发现，后者的封装技术密度更高，且性能更好，与等效单芯片封装比较的体积能够减小80%~90%之间，芯片延迟也会减小75%。从中可以分析出，电子封装在电子整机系统发展中意义重大。</span></p>

<p arial="" style="margin: 0px; padding: 0px; outline: 0px; text-align: justify; color: rgb(34, 34, 34); text-transform: none; text-indent: 0px; letter-spacing: 0.54px; clear: both; font-family: -apple-system, BlinkMacSystemFont,;"><span style="margin: 0px; padding: 0px; outline: 0px; font-family: 宋体; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word;">&nbsp;</span></p>

<p arial="" style="margin: 0px; padding: 0px; outline: 0px; text-align: justify; color: rgb(34, 34, 34); text-transform: none; text-indent: 0px; letter-spacing: 0.54px; clear: both; font-family: -apple-system, BlinkMacSystemFont,;"><span style="margin: 0px; padding: 0px; outline: 0px; font-family: 宋体; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word;">微电子封装会直接影响IC电性能以及热性能等的发挥，还会间接影响其可靠性以及成本，在电子整机系统可靠性发展与小型化发展中发挥着决定性作用。与此同时，随着大量新型IC运用高I／O引脚数封装，其成本在总成本中的比重逐渐上升，而且还会更高。现阶段，国际上已经把电子封装作为独立产业发展，其重要性与IC设计、制造以及测试并列，这四大支柱产业相互独立，但是又密不可分，对电子信息产业发展乃至国民经济发展都关系重大。根据相关研究结果显示，在50年前的时候，每个家庭仅仅有5只有源器件，然而发展到今天已经有10亿只晶体管了。换言之，电子封装与国计民生息息相关，重要性是不言而喻的。此外，微电子封装技术所涉及的范围日益扩大，被应用到了各类材料以及电子等多种学科，并受到人们的高度重视，是与IC芯片技术同步发展的重要高新产业之一。</span></p>

<p arial="" style="margin: 0px; padding: 0px; outline: 0px; text-align: justify; color: rgb(34, 34, 34); text-transform: none; text-indent: 0px; letter-spacing: 0.54px; clear: both; font-family: -apple-system, BlinkMacSystemFont,;"><span style="margin: 0px; padding: 0px; outline: 0px; font-family: 宋体; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word;">&nbsp;</span></p>

<p arial="" style="margin: 0px; padding: 0px; outline: 0px; text-align: justify; color: rgb(34, 34, 34); text-transform: none; text-indent: 0px; letter-spacing: 0.54px; clear: both; font-family: -apple-system, BlinkMacSystemFont,;"><span style="margin: 0px; padding: 0px; outline: 0px; font-family: 宋体; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word;">3 微电子封装技术应用分析</span></p>

<p arial="" style="margin: 0px; padding: 0px; outline: 0px; text-align: justify; color: rgb(34, 34, 34); text-transform: none; text-indent: 0px; letter-spacing: 0.54px; clear: both; font-family: -apple-system, BlinkMacSystemFont,;"><span style="margin: 0px; padding: 0px; outline: 0px; font-family: 宋体; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word;">&nbsp;</span></p>

<p arial="" style="margin: 0px; padding: 0px; outline: 0px; text-align: justify; color: rgb(34, 34, 34); text-transform: none; text-indent: 0px; letter-spacing: 0.54px; clear: both; font-family: -apple-system, BlinkMacSystemFont,;"><span style="margin: 0px; padding: 0px; outline: 0px; font-family: 宋体; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word;">3.1 表面封装技术</span></p>

<p arial="" style="margin: 0px; padding: 0px; outline: 0px; text-align: justify; color: rgb(34, 34, 34); text-transform: none; text-indent: 0px; letter-spacing: 0.54px; clear: both; font-family: -apple-system, BlinkMacSystemFont,;"><span style="margin: 0px; padding: 0px; outline: 0px; font-family: 宋体; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word;">&nbsp;</span></p>

<p arial="" style="margin: 0px; padding: 0px; outline: 0px; text-align: justify; color: rgb(34, 34, 34); text-transform: none; text-indent: 0px; letter-spacing: 0.54px; clear: both; font-family: -apple-system, BlinkMacSystemFont,;"><span style="margin: 0px; padding: 0px; outline: 0px; font-family: 宋体; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word;">从专业化角度出发，微电子封装技术采用的常用技术为钎焊技术，工作原理在于将表面电子元件有效钎焊到焊盘上，从而确保原件以及焊盘之间存在非常可靠的电路功能。就微电子封装技术钎焊特征上进行分析，主要包括：（1）针对表面组装技术中的软钎焊技术而言，钎焊中含有的钎剂可以有效去除金属表面杂质，让芯片表面更加的干净，使其敏感性更高，还能够提升芯片的实际使用寿命，可以说在其中发挥着相应的润滑作用。（2）钎焊金属以及钎料之间可以形成相应的金属物质，促使封装过程向着便捷化方向发展。</span></p>

<p arial="" style="margin: 0px; padding: 0px; outline: 0px; text-align: justify; color: rgb(34, 34, 34); text-transform: none; text-indent: 0px; letter-spacing: 0.54px; clear: both; font-family: -apple-system, BlinkMacSystemFont,;"><span style="margin: 0px; padding: 0px; outline: 0px; font-family: 宋体; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word;">&nbsp;</span></p>

<p arial="" style="margin: 0px; padding: 0px; outline: 0px; text-align: justify; color: rgb(34, 34, 34); text-transform: none; text-indent: 0px; letter-spacing: 0.54px; clear: both; font-family: -apple-system, BlinkMacSystemFont,;"><span style="margin: 0px; padding: 0px; outline: 0px; font-family: 宋体; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word;">3.2 芯片级互联技术</span></p>

<p arial="" style="margin: 0px; padding: 0px; outline: 0px; text-align: justify; color: rgb(34, 34, 34); text-transform: none; text-indent: 0px; letter-spacing: 0.54px; clear: both; font-family: -apple-system, BlinkMacSystemFont,;"><span style="margin: 0px; padding: 0px; outline: 0px; font-family: 宋体; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word;">&nbsp;</span></p>

<p arial="" style="margin: 0px; padding: 0px; outline: 0px; text-align: justify; color: rgb(34, 34, 34); text-transform: none; text-indent: 0px; letter-spacing: 0.54px; clear: both; font-family: -apple-system, BlinkMacSystemFont,;"><span style="margin: 0px; padding: 0px; outline: 0px; font-family: 宋体; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word;">从某种程度上讲，芯片级互联技术属于电子封装技术的重要基础，在电子封装中发挥着非常关键的作用，不管是芯片装连还是电子封装，往往都是需要在基板上操作的，所以说都需要运用到互联技术，从而使微互联发展为封装技术核心。从目前微互联技术包含内容上进行分析，包含：（1）引线键合技术，其主要内容在于将半导体芯片以及电子封装外部借助一定手段进行连接。与此同时，载体自动焊技术属于较高水准的技术，作为互联技术之一，技术内容在于根据导体图样完成高聚物引脚工作。（2）将相应晶片有效放入到所对应的键合区，然后借助热电极实现全部引线有序键合，直到键合到目前位置为止。实际上，载体自动焊技术与其他技术进行对比，发展还是比较成熟的，优点在于制作成本相对较低，且操作过程比较简单。（3）倒装芯片技术属于微电子封装的主要技术，特点在于将芯片直接倒置于相应基片上，优点在于焊区可以放置到芯片任意地方，从而大大提升了芯片利用率，发展着非常关键的作用，应用意义重大。</span></p>

<p arial="" style="margin: 0px; padding: 0px; outline: 0px; text-align: justify; color: rgb(34, 34, 34); text-transform: none; text-indent: 0px; letter-spacing: 0.54px; clear: both; font-family: -apple-system, BlinkMacSystemFont,;"><span style="margin: 0px; padding: 0px; outline: 0px; font-family: 宋体; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word;">&nbsp;</span></p>

<p arial="" style="margin: 0px; padding: 0px; outline: 0px; text-align: justify; color: rgb(34, 34, 34); text-transform: none; text-indent: 0px; letter-spacing: 0.54px; clear: both; font-family: -apple-system, BlinkMacSystemFont,;"><span style="margin: 0px; padding: 0px; outline: 0px; font-family: 宋体; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word;">4 微电子封装技术发展趋势分析</span></p>

<p arial="" style="margin: 0px; padding: 0px; outline: 0px; text-align: justify; color: rgb(34, 34, 34); text-transform: none; text-indent: 0px; letter-spacing: 0.54px; clear: both; font-family: -apple-system, BlinkMacSystemFont,;"><span style="margin: 0px; padding: 0px; outline: 0px; font-family: 宋体; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word;">&nbsp;</span></p>

<p arial="" style="margin: 0px; padding: 0px; outline: 0px; text-align: justify; color: rgb(34, 34, 34); text-transform: none; text-indent: 0px; letter-spacing: 0.54px; clear: both; font-family: -apple-system, BlinkMacSystemFont,;"><span style="margin: 0px; padding: 0px; outline: 0px; font-family: 宋体; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word;">从IC发展趋势上进行分析，随着电子整机以及系统多功能化以及高性能化的发展，微电子封装技术也会向着多功能以及低成本等方向发展，而且微电子封装技术还会更加小型化，使用更加的便捷，从根本上提升微电子封装的性价比。总体而言，微电子封装技术发展趋势可以包含以下几个方面的内容：</span></p>

<p arial="" style="margin: 0px; padding: 0px; outline: 0px; text-align: justify; color: rgb(34, 34, 34); text-transform: none; text-indent: 0px; letter-spacing: 0.54px; clear: both; font-family: -apple-system, BlinkMacSystemFont,;"><span style="margin: 0px; padding: 0px; outline: 0px; font-family: 宋体; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word;">&nbsp;</span></p>

<p arial="" style="margin: 0px; padding: 0px; outline: 0px; text-align: justify; color: rgb(34, 34, 34); text-transform: none; text-indent: 0px; letter-spacing: 0.54px; clear: both; font-family: -apple-system, BlinkMacSystemFont,;"><span style="margin: 0px; padding: 0px; outline: 0px; font-family: 宋体; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word;">（1）微电子封装将会具备更多I／0引脚数。（2）微电子封装将会具有更高电性能以及热性能。（3）微电子封装将会向着更轻、更薄以及更小发展。（4）微电子封装安装、使用及返修将会更加便捷。（5）微电子封装将会具有更高的可靠性。（6）微电子封装将会具有更高的性能价格比，成本也会更低，做到物美价廉。</span></p>

<p arial="" style="margin: 0px; padding: 0px; outline: 0px; text-align: justify; color: rgb(34, 34, 34); text-transform: none; text-indent: 0px; letter-spacing: 0.54px; clear: both; font-family: -apple-system, BlinkMacSystemFont,;"><span style="margin: 0px; padding: 0px; outline: 0px; font-family: 宋体; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word;">&nbsp;</span></p>

<p arial="" style="margin: 0px; padding: 0px; outline: 0px; text-align: justify; color: rgb(34, 34, 34); text-transform: none; text-indent: 0px; letter-spacing: 0.54px; clear: both; font-family: -apple-system, BlinkMacSystemFont,;"><span style="margin: 0px; padding: 0px; outline: 0px; font-family: 宋体; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word;">5 结语</span></p>

<p arial="" style="margin: 0px; padding: 0px; outline: 0px; text-align: justify; color: rgb(34, 34, 34); text-transform: none; text-indent: 0px; letter-spacing: 0.54px; clear: both; font-family: -apple-system, BlinkMacSystemFont,;"><span style="margin: 0px; padding: 0px; outline: 0px; font-family: 宋体; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word;">&nbsp;</span></p>

<p arial="" style="margin: 0px; padding: 0px; outline: 0px; text-align: justify; color: rgb(34, 34, 34); text-transform: none; text-indent: 0px; letter-spacing: 0.54px; clear: both; font-family: -apple-system, BlinkMacSystemFont,;"><span style="margin: 0px; padding: 0px; outline: 0px; font-family: 宋体; max-width: 100%; box-sizing: border-box !important; overflow-wrap: break-word;">总而言之，如果说将集成电路设计作为微电子产业大脑，则封装技术就属于微电子产业的重要脊梁。现阶段，国家与社会各界都高度重视微电子集成电路发展，并积极布局，促使封装技术日益强大，并为微电子行业注入新的发展力量，是我国科技强国发展战略的重要体现，有助于积极引进高精尖产业人才，促使微电子行业可持续发展。科学技术是第一生产力，微电子技术属于信息型社会的核心产业，未来会占据时代高点。因此，须要重视微电子技术发展，促使微电子封装技术不断创新，使其成为推进社会进步的不可替代的重要力量。</span><br />
<span style="font-size: 12px;">本文章来源于<span style="font-family: 宋体;"><span style="color: rgba(0, 0, 0, 0.9); text-transform: none; text-indent: 0px; letter-spacing: normal; font-style: normal; font-weight: 400; word-spacing: 0px; float: none; display: inline !important; orphans: 2; widows: 2; background-color: rgb(255, 255, 255); -webkit-text-stroke-width: 0px; font-variant-ligatures: normal; font-variant-caps: normal; text-decoration-style: initial; text-decoration-color: initial;">半导体封装工程师之家</span></span><span style="text-align: justify; -webkit-text-stroke-width: 0px;"><span style="color: rgb(51, 51, 51);"><span style="text-transform: none;"><span style="letter-spacing: 0.54px;"><span sans-serif="" style="font-family: -apple-system, BlinkMacSystemFont,;"><span style="font-style: normal;"><span style="font-weight: 400;"><span style="word-spacing: 0px;"><span style="float: none;"><span style="display: inline !important;"><span style="white-space: normal;"><span style="orphans: 2;"><span style="widows: 2;"><span style="background-color: rgb(255, 255, 255);"><span style="font-variant-ligatures: normal;"><span style="font-variant-caps: normal;"><span style="text-decoration-style: initial;"><span style="text-decoration-color: initial;">，仅限于分享交流，如侵权请联络管<span style="font-family: 宋体;">理人员</span>进行删除。</span></span></span></span></span></span></span></span></span></span></span></span></span></span></span></span></span></span></span></p>
'

'1650592098'

'1650592098'

''

array (
)

array (
)

array (
  'id' => '421',
  'catid' => '22',
  'title' => 'LTCC 封装技术研究现状与发展趋势',
  'thumb' => '',
  'keywords' => '',
  'description' => '低温共烧陶瓷 （ Low Temperature Co-Fired Ceramics, LTCC ） 封装能将不同种类的芯片等元器件组装集成于同一封装体内以实现系统的某些功能，是实现系统小型化、集成化、多功能化和高可靠性的重要手段。总结了 LTCC 基板所采用的封装方式，阐述了 LTCC 基板的金属外壳封装、针栅阵列（ Pin Grid Array, PGA） 封装、焊球阵列（ Ball Grid Array,BGA ） 封装、穿墙无引脚封装、四面引脚扁平 （ Quad Flat Package, QFP ）封装、无引脚片式载体 （ Leadless Chip Carrier, LCC ）封装和三维多芯片模块 （ Three-Dimensional Multichip Module, 3D-MCM ） 封装技术的特点及研究现状。分析了LTCC 基板不同类型封装中影响封装气密性和可靠性的一些关键技术因素，并对 LTCC 封装技术的发展趋势进行了展望。',
  'hits' => '2222',
  'uid' => '1',
  'author' => 'ruilang',
  'status' => '9',
  'url' => 'http://www.psmplasma.com/index.php?c=show&id=421',
  'link_id' => '0',
  'tableid' => '0',
  'inputip' => '',
  'inputtime' => '1649648731',
  'updatetime' => '1649648731',
  'displayorder' => '0',
  'scontent' => NULL,
  'infofrom' => '来自网络',
)

array (
  'id' => '423',
  'catid' => '22',
  'title' => '什么是晶圆级封装！Die Bond 工艺流程简介',
  'thumb' => '',
  'keywords' => '',
  'description' => '1. 【科普】什么是晶圆级封装！ 晶圆级封装(Wafer Level Packaging，缩写WLP)是一种先进的封装技术，因其具有尺寸小、电性能优良、散热好、成本低等优势，近年来发展迅速。根据Ver',
  'hits' => '1059',
  'uid' => '1',
  'author' => 'ruilang',
  'status' => '9',
  'url' => 'http://www.psmplasma.com/index.php?c=show&id=423',
  'link_id' => '0',
  'tableid' => '0',
  'inputip' => '',
  'inputtime' => '1652087883',
  'updatetime' => '1652087883',
  'displayorder' => '0',
  'scontent' => NULL,
  'infofrom' => '来自网络',
)

'微电子封装技术的优势与应用_行业动态_新闻中心_深圳市普仕曼科技有限公司'

''

'现阶段，电子封装技术在电子设备运用中发挥着非常重要的作用，特别是在电子器件功能集成以及布局优化等方面，发挥的作用日益重要，应用需求也大幅度加强。文章主要就微电子封装技术的优势与应用展开详细论述。'

array (
  'id' => '22',
  'tid' => '1',
  'pid' => '20',
  'mid' => 'news',
  'pids' => '0,20',
  'name' => '行业动态',
  'dirname' => 'industrytrends',
  'pdirname' => 'news/',
  'child' => '0',
  'childids' => '22',
  'domain' => NULL,
  'mobile_domain' => NULL,
  'thumb' => '4',
  'show' => '1',
  'content' => '',
  'setting' => 
  array (
    'disabled' => '0',
    'linkurl' => '',
    'urlrule' => 1,
    'seo' => 
    array (
      'list_title' => '[第{page}页{join}]{catpname}{join}{modname}{join}{SITE_NAME}',
      'list_keywords' => '',
      'list_description' => '',
    ),
    'template' => 
    array (
      'pagesize' => '12',
      'mpagesize' => '12',
      'page' => 'page.html',
      'list' => 'list.html',
      'category' => 'category.html',
      'search' => 'search.html',
      'show' => 'show.html',
    ),
    'cat_field' => '',
    'module_field' => '',
    'html' => 0,
    'chtml' => 0,
  ),
  'displayorder' => '0',
  'scontent' => '',
  'scentent' => NULL,
  'sname' => NULL,
  'disabled' => '0',
  'ismain' => '0',
  'duotu' => 
  array (
  ),
  'wenben' => 
  array (
  ),
  'scontent2' => NULL,
  'scontent3' => NULL,
  'channelicon' => '/Upload/icon/hyxw.png',
  'channelalbum' => 
  array (
    0 => 
    array (
      'url' => '/uploadfile/nopic',
      'file' => 'nopic',
      'title' => '',
      'description' => '',
    ),
  ),
  'topid' => '20',
  'pcatpost' => 0,
  'catids' => 
  array (
    0 => '22',
  ),
  'is_post' => 1,
  'url' => 'http://www.psmplasma.com/industrytrends.html',
  'total' => '-',
  '_duotu' => NULL,
  '_wenben' => NULL,
  '_channelalbum' => '{"file":["nopic"],"title":[""],"description":[""]}',
  'field' => 
  array (
  ),
)

array (
  'id' => '20',
  'tid' => '1',
  'pid' => '0',
  'mid' => 'news',
  'pids' => '0',
  'name' => '新闻中心',
  'dirname' => 'news',
  'pdirname' => '',
  'child' => '1',
  'childids' => '20,21,22',
  'domain' => NULL,
  'mobile_domain' => NULL,
  'thumb' => '',
  'show' => '1',
  'content' => '',
  'setting' => 
  array (
    'disabled' => '0',
    'linkurl' => '',
    'urlrule' => 1,
    'seo' => 
    array (
      'list_title' => '[第{page}页{join}]{catpname}{join}{modname}{join}{SITE_NAME}',
      'list_keywords' => '',
      'list_description' => '',
    ),
    'template' => 
    array (
      'pagesize' => '12',
      'mpagesize' => '12',
      'page' => 'page.html',
      'list' => 'list.html',
      'category' => 'category.html',
      'search' => 'search.html',
      'show' => 'show.html',
    ),
    'cat_field' => '',
    'module_field' => '',
    'html' => 0,
    'chtml' => 0,
  ),
  'displayorder' => '4',
  'scontent' => '关注新闻时讯，坚持与时俱进',
  'scentent' => NULL,
  'sname' => NULL,
  'disabled' => '0',
  'ismain' => '1',
  'duotu' => 
  array (
  ),
  'wenben' => 
  array (
  ),
  'scontent2' => NULL,
  'scontent3' => NULL,
  'channelicon' => '/Upload/icon/20.jpg',
  'channelalbum' => 
  array (
    0 => 
    array (
      'url' => '/uploadfile/nopic',
      'file' => 'nopic',
      'title' => '',
      'description' => '',
    ),
  ),
  'topid' => '20',
  'pcatpost' => 0,
  'catids' => 
  array (
    0 => '20',
    1 => '21',
    2 => '22',
  ),
  'is_post' => 0,
  'url' => 'http://www.psmplasma.com/news.html',
  'total' => '-',
  '_duotu' => NULL,
  '_wenben' => NULL,
  '_channelalbum' => '{"file":["nopic"],"title":[""],"description":[""]}',
  'field' => 
  array (
  ),
)

1

array (
  'catid' => '22',
)

array (
  'id' => '20',
  'tid' => '1',
  'pid' => '0',
  'mid' => 'news',
  'pids' => '0',
  'name' => '新闻中心',
  'dirname' => 'news',
  'pdirname' => '',
  'child' => '1',
  'childids' => '20,21,22',
  'domain' => NULL,
  'mobile_domain' => NULL,
  'thumb' => '',
  'show' => '1',
  'content' => '',
  'setting' => 
  array (
    'disabled' => '0',
    'linkurl' => '',
    'urlrule' => 1,
    'seo' => 
    array (
      'list_title' => '[第{page}页{join}]{catpname}{join}{modname}{join}{SITE_NAME}',
      'list_keywords' => '',
      'list_description' => '',
    ),
    'template' => 
    array (
      'pagesize' => '12',
      'mpagesize' => '12',
      'page' => 'page.html',
      'list' => 'list.html',
      'category' => 'category.html',
      'search' => 'search.html',
      'show' => 'show.html',
    ),
    'cat_field' => '',
    'module_field' => '',
    'html' => 0,
    'chtml' => 0,
  ),
  'displayorder' => '4',
  'scontent' => '关注新闻时讯，坚持与时俱进',
  'scentent' => NULL,
  'sname' => NULL,
  'disabled' => '0',
  'ismain' => '1',
  'duotu' => 
  array (
  ),
  'wenben' => 
  array (
  ),
  'scontent2' => NULL,
  'scontent3' => NULL,
  'channelicon' => '/Upload/icon/20.jpg',
  'channelalbum' => 
  array (
    0 => 
    array (
      'url' => '/uploadfile/nopic',
      'file' => 'nopic',
      'title' => '',
      'description' => '',
    ),
  ),
  'topid' => '20',
  'pcatpost' => 0,
  'catids' => 
  array (
    0 => '20',
    1 => '21',
    2 => '22',
  ),
  'is_post' => 0,
  'url' => 'http://www.psmplasma.com/news.html',
  'total' => '-',
  '_duotu' => NULL,
  '_wenben' => NULL,
  '_channelalbum' => '{"file":["nopic"],"title":[""],"description":[""]}',
  'field' => 
  array (
  ),
)

array (
  21 => 
  array (
    'id' => '21',
    'tid' => '1',
    'pid' => '20',
    'mid' => 'news',
    'pids' => '0,20',
    'name' => '公司新闻',
    'dirname' => 'companynews',
    'pdirname' => 'news/',
    'child' => '0',
    'childids' => '21',
    'domain' => NULL,
    'mobile_domain' => NULL,
    'thumb' => '3',
    'show' => '1',
    'content' => '',
    'setting' => 
    array (
      'disabled' => '0',
      'linkurl' => '',
      'urlrule' => 1,
      'seo' => 
      array (
        'list_title' => '[第{page}页{join}]{catpname}{join}{modname}{join}{SITE_NAME}',
        'list_keywords' => '',
        'list_description' => '',
      ),
      'template' => 
      array (
        'pagesize' => '12',
        'mpagesize' => '12',
        'page' => 'page.html',
        'list' => 'list.html',
        'category' => 'category.html',
        'search' => 'search.html',
        'show' => 'show.html',
      ),
      'cat_field' => '',
      'module_field' => '',
      'html' => 0,
      'chtml' => 0,
    ),
    'displayorder' => '0',
    'scontent' => '',
    'scentent' => NULL,
    'sname' => NULL,
    'disabled' => '0',
    'ismain' => '0',
    'duotu' => 
    array (
    ),
    'wenben' => 
    array (
    ),
    'scontent2' => NULL,
    'scontent3' => NULL,
    'channelicon' => '/Upload/icon/gsxw.png',
    'channelalbum' => 
    array (
      0 => 
      array (
        'url' => '/uploadfile/nopic',
        'file' => 'nopic',
        'title' => '',
        'description' => '',
      ),
    ),
    'topid' => '20',
    'pcatpost' => 0,
    'catids' => 
    array (
      0 => '21',
    ),
    'is_post' => 1,
    'url' => 'http://www.psmplasma.com/companynews.html',
    'total' => '-',
    '_duotu' => NULL,
    '_wenben' => NULL,
    '_channelalbum' => '{"file":["nopic"],"title":[""],"description":[""]}',
    'field' => 
    array (
    ),
  ),
  22 => 
  array (
    'id' => '22',
    'tid' => '1',
    'pid' => '20',
    'mid' => 'news',
    'pids' => '0,20',
    'name' => '行业动态',
    'dirname' => 'industrytrends',
    'pdirname' => 'news/',
    'child' => '0',
    'childids' => '22',
    'domain' => NULL,
    'mobile_domain' => NULL,
    'thumb' => '4',
    'show' => '1',
    'content' => '',
    'setting' => 
    array (
      'disabled' => '0',
      'linkurl' => '',
      'urlrule' => 1,
      'seo' => 
      array (
        'list_title' => '[第{page}页{join}]{catpname}{join}{modname}{join}{SITE_NAME}',
        'list_keywords' => '',
        'list_description' => '',
      ),
      'template' => 
      array (
        'pagesize' => '12',
        'mpagesize' => '12',
        'page' => 'page.html',
        'list' => 'list.html',
        'category' => 'category.html',
        'search' => 'search.html',
        'show' => 'show.html',
      ),
      'cat_field' => '',
      'module_field' => '',
      'html' => 0,
      'chtml' => 0,
    ),
    'displayorder' => '0',
    'scontent' => '',
    'scentent' => NULL,
    'sname' => NULL,
    'disabled' => '0',
    'ismain' => '0',
    'duotu' => 
    array (
    ),
    'wenben' => 
    array (
    ),
    'scontent2' => NULL,
    'scontent3' => NULL,
    'channelicon' => '/Upload/icon/hyxw.png',
    'channelalbum' => 
    array (
      0 => 
      array (
        'url' => '/uploadfile/nopic',
        'file' => 'nopic',
        'title' => '',
        'description' => '',
      ),
    ),
    'topid' => '20',
    'pcatpost' => 0,
    'catids' => 
    array (
      0 => '22',
    ),
    'is_post' => 1,
    'url' => 'http://www.psmplasma.com/industrytrends.html',
    'total' => '-',
    '_duotu' => NULL,
    '_wenben' => NULL,
    '_channelalbum' => '{"file":["nopic"],"title":[""],"description":[""]}',
    'field' => 
    array (
    ),
  ),
)

'/news/industrytrends/422-[page].html'

''

'http://psmplasma.com/index.php?c=show&id=422'

array (
  'c' => 'show',
  'id' => '422',
)

array (
  'company' => '深圳市普仕曼科技有限公司',
  'contact' => '杨先生',
  'telephone' => '0755-27204347',
  'mobile' => '13923479129&13510685447',
  'email' => 'edward.yang@psmplasma.com',
  'erweima' => '659',
  'postcode' => '518054',
  'address' => '深圳市宝安区沙井街道大王山工业一路2号六层',
  'T1' => '23',
  'T2' => '32',
  'T3' => '15',
  'T4' => '20',
  'T5' => '57',
  'T7' => '23',
  'nText' => '<h2 style="font-weight:bold;font-size:28px;">普仕曼科技</h2><p style="font-size:14px">专注等离子体表面处理设备</p><p>&nbsp;</p><p style="font-size:18px">质量为根本<br/>市场为导向<br/>人才为核心</p>',
  'M2' => '23',
  'M3' => '31',
  'ditubiaozhu' => '113.811818,22.717887',
  'tianditukey' => '55f4dc93d4b791534be8342cbe7440ca ',
)

array (
  'company' => '公司名称',
  'contact' => '联系人',
  'telephone' => '联系电话',
  'mobile' => '手机',
  'email' => '邮箱',
  'erweima' => '二维码',
  'postcode' => '邮编',
  'address' => '联系地址',
  'T1' => '产品',
  'T2' => '应用',
  'T3' => '关于',
  'T4' => '新闻',
  'T5' => '伙伴',
  'T7' => '内页默认导航',
  'nText' => '内页右侧富文本',
  'M2' => '手机导航1',
  'M3' => '手机导航2',
  'ditubiaozhu' => '地图标注',
  'tianditukey' => '天地图key',
)